This image provided by LG Electronics Inc. on Dec. 11, 2025, shows the concept of the AI Cabin Platform developed with Qualcomm Technologies Inc. (Yonhap)
SEOUL, Dec. 11 (Korea Bizwire) — LG Electronics Inc. plans to unveil a new artificial intelligence (AI)-based high-performance computing (HPC) solution for automobiles developed jointly with Qualcomm Technologies Inc. at a major consumer electronics trade show in the United States next month, the company said Thursday.
The South Korean tech giant said it will showcase the AI Cabin Platform for automakers, which will be applied to digital cockpits of advanced vehicles, at the Consumer Electronics Show (CES) in Las Vegas in January.
LG Electronics said the platform applies various generative AI tools, including vision and image generation models, to automobiles’ infotainment systems to enhance drivers’ experiences.
The company added that the collaboration will help LG Electronics lead the AI-defined vehicles (AIDV) industry beyond the existing software-defined vehicle (SDV) segment.
“Based on the verified technology and credibility in the global market, we will expand our strong business collaboration to lead the transition to AIDV from SDV,” Eun Seok-hyun, executive vice president of LG Electronics, said in a release.
(Yonhap)
