This photo provided by Samsung Electro-Mechanics Co. shows a sample of its flip chip ball grid array (FCBGA).
SEOUL, Feb. 27 (Korea Bizwire) — Samsung Electro-Mechanics Co., a major electronics parts maker in South Korea, said Sunday it had developed an advanced driver assistance systems (ADAS)-applicable flip chip ball grid array (FCBGA) and will expand its product lineup for automotive electronics.
The newly-developed FCBGA is a substrate for high-performance self-driving systems that is one of the products with the highest technological levels among those for automotive electronics.
By applying its microcircuit technology accumulated in the areas of high-end IT products such as servers for automotive electronics, Samsung Electro-Mechanics reduced circuit width and spacing by 20 percent compared to existing substrates for the stage of partial driving automation.
Accordingly, more than 10,000 bumps were realized in a passport photo-sized space.
In addition, reliability was also addressed, including an improvement in flexural strength, to cope with multi-chip packages in which several chips are mounted on a single substrate at the same time.
Kevin Lee (kevinlee@koreabizwire.com)
