SEOUL, Jul. 18 (Korea Bizwire) — Samsung Electronics Co. said Tuesday it expanded production of new high-performance dynamic random-access memory (DRAM) chips that can be utilized for artificial intelligence (AI) systems.
The South Korean tech giant said it kicked off full-fledged mass production of the industry’s first high-performance 8GB High Bandwidth Memory 2 (HBM) DRAM chips, applied to super computers, network solutions and graphic cards.
The new chip boasts a faster data-transmission speed of 256 gigabytes per second, which allows 13 Ultra HD movies to be sent in a second.
Samsung said the high-capacity, high-speed and power efficient solution was made possible via the company’s 850 patents, including Through Silicon Via (TSV) technology.
The 8GB solution is the same size as the 4GB-HBM2 DRAM chips but comes with two times the capacity.
“Through the release of the next-generation 8GB HBM2 DRAM, we plan to expand business cooperation with various global clients,” Samsung said.
Samsung said it plans to expand production of 8GB models to take up 50 percent of the combined HBM2 production by the first half of 2018, in line with the rising demand from the premium DRAMs.