Samsung Electronics’ latest mobile AP, the “Exynos 2500″
SEOUL, June 24 (Korea Bizwire) — Samsung Electronics has officially introduced the Exynos 2500, its most advanced smartphone processor to date, signaling a major leap in chip design and manufacturing ahead of next month’s Galaxy Unpacked event in New York.
Detailed on Samsung’s official website, the Exynos 2500 is the first smartphone application processor (AP) to be manufactured using the company’s 3-nanometer gate-all-around (GAA) process—a cutting-edge chip fabrication technology developed by Samsung Foundry. The chip was designed by the System LSI division within Samsung’s Device Solutions (DS) business unit.
Samsung has labeled the Exynos 2500 as being in “mass production,” indicating that manufacturing yields have reached a commercially viable level. Industry sources expect the chip to be exclusively featured in the upcoming Galaxy Z Flip 7, marking the first time a foldable Galaxy flagship will run on an Exynos chip. Until now, Samsung’s foldable devices have relied exclusively on Qualcomm Snapdragon processors.
The Exynos 2500 is tailored for next-generation AI smartphones, delivering 59 trillion operations per second (TOPS)—a 39% improvement over its predecessor, the Exynos 2400. It supports AI-powered image processing, up to 320MP camera resolution, and 8K video recording at 60 frames per second.
Built with Arm’s latest deca-core CPU architecture, the chip offers a 15% performance boost over the previous model. Samsung also employed Fan-Out Wafer Level Packaging (FOWLP) to enhance power efficiency, a key requirement for foldable devices with limited battery space.
Samsung first deployed its 3nm GAA process in 2023 with the Exynos W1000 chip for wearables, used in the Galaxy Watch 7. The Exynos 2500 now represents the company’s first 3nm GAA chip for smartphones.
The chip will make its debut at Galaxy Unpacked 2025, scheduled for July 9 in Brooklyn, where Samsung will unveil its latest foldables—the Galaxy Z Flip 7 and Fold 7—featuring enhanced AI capabilities and ultra-slim designs.
Kevin Lee (kevinlee@koreabizwire.com)
