This image provided by SK hynix Inc. shows the company’s exhibition at CES 2025. (Image courtesy of Yonhap)
SEOUL, Jan. 3 (Korea Bizwire) — SK hynix Inc. said Friday it will showcase its cutting-edge artificial intelligence memory technologies at the upcoming CES 2025, presenting its vision as a comprehensive AI memory provider.
The chipmaker, which currently leads the high bandwidth memory (HBM) industry, will set up a joint exhibition booth with SK Group affiliates, including SK Telecom Co., under the theme “Innovative AI, Sustainable Tomorrow,” at this year’s CES set to kick off Tuesday (U.S. time) in Las Vegas, according to SK hynix.
Top executives from SK hynix, including CEO Kwak Noh-jung and Kim Joo-seon, president of AI Infrastructure, will be present to highlight the company’s technological advancements and strategic direction.
SK hynix aims to use the annual event to reinforce its position as a “full stack AI memory provider,” delivering a wide range of AI-focused memory products and technologies.
At CES 2025, SK hynix plans to unveil its innovations in on-device AI solutions, next-generation AI memories and its flagship HBM chips.
A highlight of the exhibit will be samples of its 16-layer HBM3E chips, the most advanced HBM technology developed to date, officially introduced in November 2024.
SK hynix is now supplying the 12-layer HBM3E chips to customers, while working on developing HBM4, the sixth-generation HBM, in the second half of this year.
In addition, the company will display high-capacity, high-performance enterprise solid state drive (eSSD) products, including the D5-P5336 122TB model, developed by its U.S. subsidiary Solidigm in November last year.
“We will continue to do our best to present new possibilities in the AI era through technological innovation and provide irreplaceable value to our customers,” CEO Kwak said in a press release.
(Yonhap)
