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S. Korea’s Presence in Chinese Chip Market Shrinks After U.S. Sanctions Chinese Firms

S. Korea’s Presence in Chinese Chip Market Shrinks After U.S. Sanctions Chinese Firms

SEOUL, April 26 (Korea Bizwire) — After the U.S. slapped sanctions on a string of Chinese companies, Taiwanese and Japanese chipmakers enjoyed a stronger presence in the Chinese chip market, while South Korean chipmakers’ standing there weakened, the business lobby group said Monday. The Federation of Korean Industriesanalyzed the changes in the market shares of [...]

S. Korea’s Chip, Display Industries Intact from Japan’s Export Curbs

S. Korea’s Chip, Display Industries Intact from Japan’s Export Curbs

SEOUL, Nov. 24 (Korea Bizwire) — South Korea’s chip and display industries, the backbone of Asia’s No. 4 economy, have remained intact since Tokyo’s export curbs against the Asian neighbor, Seoul’s trade ministry said Sunday. The country’s top four tech giants — Samsung Electronics Co., Samsung Display Co., SK hynix Inc. and LG Display Co. [...]

Seoul to Spend 240 bln Won for Next-generation Chip Technology

Seoul to Spend 240 bln Won for Next-generation Chip Technology

SEOUL, May 9 (Korea Bizwire) — South Korea will spend 240 billion won (US$204 million) in the next 10 years to develop key semiconductor technologies that can alter the paradigm of the chip industry as a whole, the science ministry said Thursday. The medium-to-long term chip sector growth plan centers around securing know-how in such [...]

Baidu Unveils High-Performance AI Chip, Kunlun, at Baidu Create 2018

Baidu Unveils High-Performance AI Chip, Kunlun, at Baidu Create 2018

BEIJING, Jul. 3 (Korea Bizwire) — Baidu Inc. (NASDAQ:BIDU) today announced Kunlun, China’s first cloud-to-edge AI chip, built to accommodate high performance requirements of a wide variety of AI scenarios. The announcement includes training chip “818-300”and inference chip “818-100”. Kunlun can be applied to both cloud and edge scenarios, such as data centers, public clouds [...]

Teledyne e2v Unveils its Next Ultra-compact Advanced Computing Module to Join its Qormino® Family

Teledyne e2v Unveils its Next Ultra-compact Advanced Computing Module to Join its Qormino® Family

HONG KONG, CHINA, Jul. 3 (Korea Bizwire) — Just two years since the launch of the first prototype of the Qormino® family, Teledyne e2v has announced the QLS1046-4GB, the next module to join what has become an established line of computing modules. The Qormino® concept is to reduce time-to-market for system designers by offering a [...]

Teledyne DALSA Introduces Wafer Level-Packaging to its LWIR Imaging Platform

Teledyne DALSA Introduces Wafer Level-Packaging to its LWIR Imaging Platform

WATERLOO, ON, Aug. 31 (Korea Bizwire) - Teledyne DALSA (NYSE: TDY), a Teledyne Technologies company and global leader in image sensing technology, will demonstrate its Wafer-Level-Packaged (WLP) 320 x 240 Vanadium Oxide microbolometer at the upcoming Defence & Security Equipment International Show (DSEI) UK in booth S10-268. In addition, the company will display its real time LWIR-Visible image fusion OEM sub-system, which is configured from the [...]

S. Korea Develops ‘Nanotechnology Patch’ for Diabetes Therapy

S. Korea Develops ‘Nanotechnology Patch’ for Diabetes Therapy

SEOUL, March 22 (Korea Bizwire) – A team of South Korean scientists announced Tuesday that they have developed a wearable device, based on nanotechnology, for more convenient diabetes monitoring and therapy. The graphene-using “smart patch” has improved the accuracy of blood sugar level measurements as it checks not only glucose in sweat but also temperature [...]