Industry Ministry Signs MOU with Samsung, SK hynix on Semiconductor Packaging
SEOUL, Aug. 29 (Korea Bizwire) – The industry ministry said Tuesday it signed a memorandum of understanding (MOU) with Samsung Electronics Co., SK hynix Inc. and other chip firms to cooperate on technology development for advanced semiconductor packaging. Under the MOU, the government and chipmakers agreed to work together to secure leading technologies in advanced [...]