SK hynix to Prioritize Advanced Packaging Technology for Next-Generation HBM Chips

SEOUL, Aug. 5 (Korea Bizwire) – SK hynix Inc., the world’s second-largest maker of memory chips, said Monday it will focus on developing advanced packaging technologies for next-generation high bandwidth memory (HBM) chips, aiming to solidify its leadership position in the booming artificial intelligence (AI) chip market. HBM is a high-performance DRAM in high demand, [...]