chip packaging tech Archives

Samsung Develops Advanced Chip Packaging Tech for High-performance Applications

SEOUL, May 6 (Korea Bizwire) — Samsung Electronics Co. said Thursday it has developed an advanced chip packaging technology for high-performance applications as the South Korean tech giant eyes to expand its leadership in semiconductor solutions. The world’s largest memory chip maker said its next-generation 2.5D packaging technology, Interposer-Cube4 (I-Cube4), is expected to be widely [...]

Samsung’s Advanced Chip Packaging Solution Ready for Use

SEOUL, Aug. 13 (Korea Bizwire) — Samsung Electronics Co. said Thursday that its advanced chip packaging technology is now ready for use after the company succeeded in producing test chips with the solution that can improve speed and power efficiency of logic semiconductors. Its silicon-proven 3D integrated circuit (IC) packaging technology, dubbed “eXtended-Cube” or simply [...]