Teledyne DALSA Introduces Wafer Level-Packaging to its LWIR Imaging Platform

WATERLOO, ON, Aug. 31 (Korea Bizwire) - Teledyne DALSA (NYSE: TDY), a Teledyne Technologies company and global leader in image sensing technology, will demonstrate its Wafer-Level-Packaged (WLP) 320 x 240 Vanadium Oxide microbolometer at the upcoming Defence & Security Equipment International Show (DSEI) UK in booth S10-268. In addition, the company will display its real time LWIR-Visible image fusion OEM sub-system, which is configured from the [...]