Samsung’s Pyeongtaek campus in Pyeongtaek, 70 kilometers south of Seoul, is seen in this photo provided by Samsung Electronics Co. on Sept. 7, 2022.
SEOUL, May 22 (Korea Bizwire) — Samsung Electronics Co. is accelerating the development of its ‘digital twin’ technology to improve efficiency in semiconductor manufacturing.
According to industry sources, Samsung’s Device Solution (DS) division, which oversees its chip business, recently appointed Executive Vice President Lee Young-woong as the head of the Digital Twin Task Force.
This task force was established as part of an organizational reshuffle in late last year.
Lee, an MIT graduate, previously held positions in technology integration and robotics at General Electric Co. and Shell PLC.
Digital twin technology involves analyzing and forecasting various scenarios using artificial intelligence (AI) and big data, creating virtual replicas of real-world objects.
In the case of semiconductor circuits, the production lines become more complex as the circuits become smaller, requiring an increase in equipment.
Failing to control various variables in the factory can result in more defective products, reduced profits, and technological competitiveness decline.
Consequently, Samsung and Lee are expected to explore methods for efficient management of semiconductor factories, focusing on defect prediction through digital twin and digital transformation (DX) technology while enhancing potential.
J. S. Shin (js_shin@koreabizwire.com)
