Samsung Electro-Mechanics to Ramp Up Chip Package Substrate Production Capacity
SEOUL, March 22 (Korea Bizwire) — Samsung Electro-Mechanics Co., a major electronics parts maker in South Korea, said Monday it will invest about 300 billion won (US$245 million) to expand flip-chip ball grid array (FC-BGA) circuit boards manufacturing capacity at its plant in Busan. This move came after the company decided to invest about 1.3 [...]