chip Archives | Page 2 of 2

Home / Posts tagged chip (Page 2)

Teledyne DALSA Introduces Wafer Level-Packaging to its LWIR Imaging Platform

WATERLOO, ON, Aug. 31 (Korea Bizwire) - Teledyne DALSA (NYSE: TDY), a Teledyne Technologies company and global leader in image sensing technology, will demonstrate its Wafer-Level-Packaged (WLP) 320 x 240 Vanadium Oxide microbolometer at the upcoming Defence & Security Equipment International Show (DSEI) UK in booth S10-268. In addition, the company will display its real time LWIR-Visible image fusion OEM sub-system, which is configured from the [...]

Samsung Narrows Gap with Intel in Chip Segment

SEOUL, April 11 (Korea Bizwire) – Samsung Electronics Co. came closer last year to catching up with its archrival in the semiconductor industry, Intel Corp., data showed Monday. The South Korean tech giant accounted for 11.6 percent of the chip market in 2015, up 0.9 percentage points from a year earlier, standing as the No. 2 player, [...]

S. Korea Develops ‘Nanotechnology Patch’ for Diabetes Therapy

SEOUL, March 22 (Korea Bizwire) – A team of South Korean scientists announced Tuesday that they have developed a wearable device, based on nanotechnology, for more convenient diabetes monitoring and therapy. The graphene-using “smart patch” has improved the accuracy of blood sugar level measurements as it checks not only glucose in sweat but also temperature [...]