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Lam Research Enables Next-Generation Memory with Industry’s First ALD Process for Low-Fluorine Tungsten Fill

Lam Research Enables Next-Generation Memory with Industry’s First ALD Process for Low-Fluorine Tungsten Fill

FREMONT, CA, Aug. 9 (Korea Bizwire) – Lam Research Corp. (NASDAQ: LRCX), an advanced manufacturer of semiconductor equipment, today introduced an atomic layer deposition (ALD) process for depositing low-fluorine-content tungsten films, the latest addition to its industry-leading ALTUS® family of products. With the industry’s first low-fluorine tungsten (LFW) ALD process, the ALTUS Max E Series [...]

Lam Research Launches Flex™ G Series for High-Aspect-Ratio Dielectric Etch

Lam Research Launches Flex™ G Series for High-Aspect-Ratio Dielectric Etch

FREMONT, CA, Jul. 13 (Korea Bizwire) – Lam Research Corp. (NASDAQ: LRCX), a major global supplier of innovative wafer fabrication equipment and services to the semiconductor industry, today announced it has introduced the Flex™ G Series for high-aspect-ratio (HAR) dielectric etch to enable the continued scaling of DRAM and 3D NAND devices. The HAR capacitor [...]

Lam Research Releases High-Productivity VECTOR® ALD Oxide Deposition System

Lam Research Releases High-Productivity VECTOR® ALD Oxide Deposition System

FREMONT, CA, Jul. 13 (Korea Bizwire) – Lam Research Corp. (NASDAQ: LRCX), a major global supplier of innovative wafer fabrication equipment and services to the semiconductor industry, today announced it has released its high-productivity VECTOR® ALD Oxide system on the Extreme platform. The new product uses atomic layer deposition (ALD) to create highly conformal dielectric [...]

Lam Research Kiyo® F Series Enables Critical Conductor Etch for Advanced Memory

Lam Research Kiyo® F Series Enables Critical Conductor Etch for Advanced Memory

FREMONT, CA,  May 18 (Korea Bizwire) – Lam Research Corp. (NASDAQ: LRCX), a major global supplier of innovative wafer fabrication equipment and services to the semiconductor industry, today announced its Kiyo® F Series conductor etch system is enabling the transition of 3D NAND and advanced DRAM into volume production. Key etch requirements for these applications [...]