This photo provided by LG Innotek Co. on Dec. 10, 2025, shows a mock credit card installed with the company’s next-generation smart IC substrate. (Yonhap)
SEOUL, Dec. 10 (Korea Bizwire) — LG Innotek Co., a major South Korean electronics parts maker, has developed a next-generation smart integrated circuit (IC) substrate that cuts carbon emissions during the manufacturing process by nearly 50 percent compared with existing products, the company said Wednesday.
Smart IC substrates are essential parts used to mount IC chips containing personal security data in credit cards, electronic passports and smartphone universal subscriber identity module (USIM) cards.
LG Innotek said the new product eliminates the need for precious-metal plating by applying a new high-performance material.
As a result, the new substrate can reduce annual carbon emissions by 8,500 tons, an amount equivalent to planting about 1.3 million trees. The company added that the substrate’s durability has been strengthened about threefold.
LG Innotek said it has started mass production of the new smart IC substrate in November for a major global smart-card manufacturer. The company has also secured around 20 domestic patents related to the technology and plans to register additional patents in the United States, Europe and China.
(Yonhap)
