At Samsung’s booth during “SEDEX 2025,” held on Oct. 22 at COEX in Seoul’s Gangnam District, physical samples of the company’s sixth-generation high-bandwidth memory chips, HBM4 and HBM3E, are on display. (Yonhap)
SEOUL, Feb. 11 (Korea Bizwire) — Samsung Electronics Chief Technology Officer (CTO) Song Jai-hyuk on Wednesday expressed confidence over the company’s leadership in sixth-generation high bandwidth memory (HBM), or HBM4, ahead of the upcoming first shipment of the new product later this month.
Song made the remark on the margins of Semicon Korea 2026, an annual exhibition of semiconductor companies, which kicked off in Seoul on the day for a three-day run.
“Samsung, which has been responding (to the market) with the world’s top technology, is just showing its true self,” Song said when asked about the strength of the South Korean tech giant’s HBM4 products.
“Samsung, which holds (a portfolio spanning) memory, foundry and packaging, has the optimized environment to produce products needed for the AI sector, and they are currently generating synergy,” Song said.
Song noted clients are expressing satisfaction with Samsung’s HBM4 products, adding the company will continue its efforts to take leadership in next-generation HBM4E and HBM5 products.
Samsung Electronics is widely expected to start shipping HBM4 products to Nvidia Corp. following the Lunar New Year holiday next week.
Semicon Korea 2026, with 550 global companies participating, is anticipated to draw 70,000 industry officials, according to its organizer.
Under the theme “Transform Tomorrow,” businesses are anticipated to share their latest progress in the semiconductor industry amid the memory supercycle sparked by the global AI boom.
(Yonhap)
