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Samsung Develops Advanced Chip Packaging Tech for High-performance Applications

Samsung Develops Advanced Chip Packaging Tech for High-performance Applications

SEOUL, May 6 (Korea Bizwire) — Samsung Electronics Co. said Thursday it has developed an advanced chip packaging technology for high-performance applications as the South Korean tech giant eyes to expand its leadership in semiconductor solutions. The world’s largest memory chip maker said its next-generation 2.5D packaging technology, Interposer-Cube4 (I-Cube4), is expected to be widely [...]

Samsung Suffers More than 300 bln-won Loss Due to Monthlong Texas Chip Shutdown

Samsung Suffers More than 300 bln-won Loss Due to Monthlong Texas Chip Shutdown

SEOUL, April 29 (Korea Bizwire) — Samsung Electronics Co. said Thursday that a monthlong shutdown at its U.S. semiconductor plant cost it more than 300 billion won (US$270 million) in losses, although the facility is now fully normalized. “There was a wafer production disruption due to the stopping and recovering of the fab,” Han Seung-hoon, [...]