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Samsung Unveils 3 New Power Management ICs for DDR5 DRAM Modules

Samsung Unveils 3 New Power Management ICs for DDR5 DRAM Modules

SEOUL, May 18 (Korea Bizwire) — Samsung Electronics Co. on Tuesday unveiled new power-controlling chips that minimize overall power consumption while boosting performance of dynamic random-access memory (DRAM). The world’s largest memory chip producer said its three power management integrated circuit (PMIC) products — S2FPD01, S2FPD02, and S2FPC01 — are available for DDR5 DRAM modules. [...]

SK hynix Looking to Double its Foundry Capacity with Possible M&A Deals

SK hynix Looking to Double its Foundry Capacity with Possible M&A Deals

SEOUL, May 13 (Korea Bizwire) — SK hynix Inc., South Korea’s second-largest chipmaker, said Thursday it is considering doubling its foundry capacity with options, including domestic facility expansion and merger and acquisition deals. Park Jung-ho, co-CEO and vice chairman at SK hynix, made the remarks during a government event for the country’s semiconductor vision, under [...]

S. Korea to Emerge as No. 1 Chip Powerhouse with 510 tln-won Investment by 2030

S. Korea to Emerge as No. 1 Chip Powerhouse with 510 tln-won Investment by 2030

SEOUL, May 13 (Korea Bizwire) – South Korea said Thursday it plans to provide massive tax incentives and state subsidies to chipmakers to encourage them to spend a combined 510 trillion won (US$453 billion) by 2030, in line with its vision to become a global powerhouse in both memory and non-memory chips. Under the plan [...]

Samsung Develops Advanced Chip Packaging Tech for High-performance Applications

Samsung Develops Advanced Chip Packaging Tech for High-performance Applications

SEOUL, May 6 (Korea Bizwire) — Samsung Electronics Co. said Thursday it has developed an advanced chip packaging technology for high-performance applications as the South Korean tech giant eyes to expand its leadership in semiconductor solutions. The world’s largest memory chip maker said its next-generation 2.5D packaging technology, Interposer-Cube4 (I-Cube4), is expected to be widely [...]