SEOUL, June 23 (Korea Bizwire) – Samsung Electro-Mechanics Co., a major electronics components maker in South Korea, said Thursday it will make an additional investment of 300 billion won (US$230 million) in its flip-chip-ball grid array (FC-BGA) business, aimed at expanding the production of its plants in Busan, Sejong and Vietnam.
Prior to this, the company unveiled a string of investment plans for semiconductor package substrates, including 1.3 trillion won for its Vietnamese plant in December 2021 and 300 billion won for its Busan plant in March 2022.
The latest investment decision will bring the total amount of investment to expand the production of semiconductor package substrates up to 1.9 trillion won.
The package substrate market is expected to see a sharp increase in demand centered on high-end products thanks to the upgrading trend of central processing units (CPU) and graphic processing units (GPU).
In reality, Samsung Electro-Mechanics is now witnessing an increasing demand for high-end package substrates from global clients. In addition, thanks to the expansion of autonomous driving, the package substrate demand for use in automotive electronics is also increasing.
The company is supplying semiconductor package substrates to global companies such as Apple, Qualcomm and Intel according to industry sources.
In the meantime, Samsung Electro-Mechanics also announced a plan to start mass-producing semiconductor package substrates by the end of this year for the first time in South Korea.
J. S. Shin (firstname.lastname@example.org)