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Samsung Electronics to Expand Chip Packaging Facilities for HBM

Samsung Electronics to Expand Chip Packaging Facilities for HBM

SEOUL, Nov. 12 (Korea Bizwire) — Samsung Electronics Co. will expand its semiconductor package facilities in South Chungcheong Province to boost production of high bandwidth memory (HBM) chips, company officials said Tuesday. Under a memorandum of understanding with the provincial government, Samsung Electronics will convert an underused liquid crystal display plant owned by Samsung Display [...]

Samsung Electronics Says Smooth Progress in Testing Latest HBM Chips

Samsung Electronics Says Smooth Progress in Testing Latest HBM Chips

SEOUL, May 24 (Korea Bizwire) – Samsung Electronics Co., the world’s largest memory chipmaker, said Friday the testing process of its latest high-bandwidth memory (HBM) chips is proceeding smoothly in cooperation with its customers. “Samsung Electronics is currently working closely with a number of companies to continuously test the technology and performance,” the company said [...]

SK Hynix Held ‘SK Hynix HBM Symposium 2014′

SK Hynix Held ‘SK Hynix HBM Symposium 2014′

SEOUL, South Korea, June 18, 2014 (Korea Bizwire)–SK Hynix Inc. (or ‘the Company’, www.skhynix.com)  announced that it held ‘SK Hynix HBM(High Bandwidth Memory) Symposium  2014’ at SK Hynix America Headquarters in San Jose, California on June  18th local time. Approximately 100 people from 20 major clients and partners who are  leading relevant industries participated in [...]