Samsung Electronics to Expand Chip Packaging Facilities for HBM
SEOUL, Nov. 12 (Korea Bizwire) — Samsung Electronics Co. will expand its semiconductor package facilities in South Chungcheong Province to boost production of high bandwidth memory (HBM) chips, company officials said Tuesday. Under a memorandum of understanding with the provincial government, Samsung Electronics will convert an underused liquid crystal display plant owned by Samsung Display [...]