A TC Bonder (Image courtesy of Hanmi Semiconductor)
SEOUL, March 18 (Korea Bizwire) — A battle is brewing in South Korea’s semiconductor equipment industry as SK Hynix, one of the world’s largest memory chip makers, moves to diversify its suppliers of crucial chip-stacking machinery, challenging the longtime market dominance of Hanmi Semiconductor.
The competition centers on thermal compression bonders (TC bonders), essential equipment used in manufacturing high bandwidth memory (HBM) chips — a critical component in artificial intelligence processors. These machines apply heat and pressure to stack multiple DRAM chips together, a process fundamental to creating the advanced memory products that power AI applications.
In a significant market shift, Hanwha Semitech recently secured a 21 billion won contract with SK Hynix after passing final quality verification tests. The deal marks SK Hynix’s first step toward a dual-vendor strategy for TC bonders, departing from its previous exclusive reliance on Hanmi Semiconductor’s equipment for its HBM3E 12-layer manufacturing process.
The move has prompted a sharp response from Hanmi Semiconductor’s chairman, Kwak Dong Shin. “There is a considerable technological gap between us and late entrants like ASMPT and Hanwha Semitech,” Kwak said in a statement. “Like ASMPT before them, Hanwha Semitech’s orders from SK Hynix will likely amount to minimal quantities that ultimately lead nowhere.”
Industry observers suggest that while Hanmi Semiconductor maintains over 90% market share, Hanwha Semitech’s entry into SK Hynix’s supply chain could be particularly significant given SK Hynix’s role as a key supplier to Nvidia, the dominant force in AI chips. Some analysts project that Hanwha Semitech could secure orders for more than 30 of the 60 to 80 TC bonders SK Hynix is expected to purchase this year.
Defending its market position, Hanmi Semiconductor emphasized its 45-year history, portfolio of over 120 HBM equipment patents, and global customer base including SK Hynix and Micron Technology. The company is constructing an 89,530-square-meter semiconductor equipment production cluster in Incheon’s Seo-gu district, scheduled for completion in the fourth quarter, to expand its production capacity.
“We plan to deliver more than 300 TC bonders this year without any setbacks, leveraging our world-leading production capacity,” Kwak said.
Meanwhile, Hanwha Semitech is positioning itself for growth. Kim Dong-seon, head of future vision at Hanwha Semitech and the third son of Hanwha Group Chairman Kim Seung-youn, outlined the company’s strategy at last month’s SEMICON Korea 2025, the country’s largest semiconductor exhibition.
“While we may be latecomers in the back-end process segment, including HBM TC bonders, market competitiveness ultimately depends on technological innovation,” Kim said, pledging continued investment in research and development.
Kevin Lee (kevinlee@koreabizwire.com)
