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SK Hynix to Invest US$3.87 Bln to Build Packaging Facility in U.S.

SK Hynix to Invest US$3.87 Bln to Build Packaging Facility in U.S.

SEOUL, Apr. 4 (Korea Bizwire) — South Korean chipmaker SK hynix Inc. said Thursday it will invest US$3.87 billion to build an advanced packaging fabrication and R&D facility in the United States amid intensifying competition in the high-performance artificial intelligence (AI) memory semiconductor sector. The new facility, located in West Lafayette, Indiana, will begin mass-producing [...]

Gov. Holcomb, IEDC Announce Generational Multi-billion-dollar Investment to Make Indiana Leader in Semiconductor Packaging

Gov. Holcomb, IEDC Announce Generational Multi-billion-dollar Investment to Make Indiana Leader in Semiconductor Packaging

SK hynix’s new West Lafayette plant and investment in research and development bolsters Indiana’s booming semiconductor ecosystem, attracting talent and supporting US innovation, technology and security WEST LAFAYETTE, Ind., Apr. 3 (Korea Bizwire) — Governor Eric J. Holcomb, Secretary of Commerce David Rosenberg and Purdue University President Mung Chiang joined federal partners and executives of [...]