U.S. Semiconductor Packaging Firm Files Lawsuit Against Samsung Electronics | Be Korea-savvy

U.S. Semiconductor Packaging Firm Files Lawsuit Against Samsung Electronics


According to the sources, Tessera Technologies Inc. and its affiliates claimed Samsung Electronics made use of some 24 patented items, covering a wide range of semiconductor processing, bonding and packaging technologies. (Image: Yonhap)

According to the sources, Tessera Technologies Inc. and its affiliates claimed Samsung Electronics made use of some 24 patented items, covering a wide range of semiconductor processing, bonding and packaging technologies. (Image: Yonhap)

SEOUL, Sept. 29 (Korea Bizwire) – A U.S.-based semiconductor technology company filed a lawsuit against Samsung Electronics Co. claiming patent infringement, industry sources said Friday.

According to the sources, Tessera Technologies Inc. and its affiliates claimed Samsung Electronics made use of some 24 patented items, covering a wide range of semiconductor processing, bonding and packaging technologies.

The Samsung products involved in the alleged infringements include the Galaxy S6, S7 and S8 smartphones, as well as the Galaxy Note 8 phablet.

“Samsung has benefited from its use of our semiconductortechnologies for 20 years, having entered into its first license with Tessera, Inc. in 1997,” Xperi Corp., Tessera’s holding firm said.

“Samsung’s most recent semiconductor patent license expired in December 2016, but we believe it is continuing to use our patented technologies without authorization, and without paying us fair compensation,” it added.

Tessera said the legal proceedings were filed at the U.S. International Trade Commission, three U.S. federal district courts and with “certain international jurisdictions.”

(Yonhap)

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