
This third fab brings TSMC’s total U.S. investment to more than $65 billion, making this the largest foreign direct investment (FDI) in Arizona history. (Image courtesy of TSMC)
SEOUL, Jan. 14 (Korea Bizwire) — Taiwan Semiconductor Manufacturing Company (TSMC) has officially commenced mass production of advanced 4-nanometer (nm) chips at its Arizona facility, marking a significant milestone in the United States’ push for semiconductor self-sufficiency and technological leadership.
U.S. Commerce Secretary Gina Raimondo announced on January 11, 2025, that for the first time in history, 4nm semiconductor chips are being produced on American soil.
Raimondo emphasized that American workers are manufacturing chips at yield rates and quality comparable to Taiwan’s, calling it a breakthrough many once thought impossible and a key achievement in the Biden administration’s semiconductor strategy.
Currently, the most advanced commercial semiconductor technology is the 3nm process. Both TSMC and Samsung Electronics are producing 3nm chips in Taiwan and South Korea, respectively. To bridge the technological gap, the U.S. government offered substantial subsidies to attract TSMC, which has now started 4nm chip production.
In April 2024, TSMC expanded its U.S. investment to $65 billion, with plans to build a third fabrication plant in Arizona by 2030 that will support 2nm technology.
Samsung Electronics is also advancing its U.S. semiconductor production. The company plans to equip its Taylor, Texas, plant by 2026 and begin mass production of advanced chips in 2027.

Samsung Electronics Co.’s semiconductor facilities in Austin, Texas, in this photo provided by the company (Image courtesy of Yonhap)
Samsung aims to enhance its competitive edge by applying next-generation Gate-All-Around (GAA) technology to its cutting-edge nodes. As the first company to commercialize GAA, Samsung’s design allows the transistor gate to surround all sides of the channel, enabling more precise current control.
Additionally, Samsung is implementing a ‘One Team’ collaboration model, integrating its memory, foundry, and advanced packaging divisions to offer turnkey solutions optimized for Big Tech’s growing demand for AI chips. This approach is projected to reduce the chip development-to-production timeline by about 20% for fabless clients.
Samsung recently appointed Han Jin-man as the new head of its Foundry Business Division, focusing on yield stabilization and securing major Big Tech clients to drive business recovery.
Samsung has also secured $4.75 billion in subsidies under the U.S. CHIPS and Science Act. DS Division Vice Chairman Jun Young-hyun stated that the agreement marks a significant milestone in building a cutting-edge semiconductor ecosystem and anticipates further collaboration with U.S. partners to meet the demands of an AI-driven future.
Samsung’s Taylor plant, which broke ground in 2022, is central to the company’s ‘System Semiconductor Vision 2030′ strategy to become the global leader in system semiconductors by 2030. The facility represents a key investment to strengthen Samsung’s competitiveness in the foundry market.
Kevin Lee (kevinlee@koreabizwire.com)