Samsung Electronics Develops 36GB HBM3E with 12 Layers
SEOUL, Feb. 27 (Korea Bizwire) — Samsung Electronics Co. said Tuesday it has developed the fifth generation high bandwidth memory (HBM) chips with 12 layers of DRAM chips, helping it lead the booming market for advanced chips. With the industry’s largest capacity of 36 gigabytes (GB), Samsung Electronics said it plans to mass-produce the product [...]